JPS6314466Y2 - - Google Patents

Info

Publication number
JPS6314466Y2
JPS6314466Y2 JP1983158834U JP15883483U JPS6314466Y2 JP S6314466 Y2 JPS6314466 Y2 JP S6314466Y2 JP 1983158834 U JP1983158834 U JP 1983158834U JP 15883483 U JP15883483 U JP 15883483U JP S6314466 Y2 JPS6314466 Y2 JP S6314466Y2
Authority
JP
Japan
Prior art keywords
resin
circuit element
metal body
semiconductor
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983158834U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6066037U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983158834U priority Critical patent/JPS6066037U/ja
Publication of JPS6066037U publication Critical patent/JPS6066037U/ja
Application granted granted Critical
Publication of JPS6314466Y2 publication Critical patent/JPS6314466Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1983158834U 1983-10-14 1983-10-14 樹脂封止型半導体装置 Granted JPS6066037U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983158834U JPS6066037U (ja) 1983-10-14 1983-10-14 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983158834U JPS6066037U (ja) 1983-10-14 1983-10-14 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6066037U JPS6066037U (ja) 1985-05-10
JPS6314466Y2 true JPS6314466Y2 (en]) 1988-04-22

Family

ID=30349807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983158834U Granted JPS6066037U (ja) 1983-10-14 1983-10-14 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS6066037U (en])

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111943U (ja) * 1982-01-27 1983-07-30 新電元工業株式会社 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS6066037U (ja) 1985-05-10

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